Handbook of Thin Film Deposition by Krishna Seshan Dominic Schepis & Dominic Schepis

Author:Krishna Seshan,Dominic Schepis & Dominic Schepis
Language: eng
Format: epub
ISBN: 9780128123126
Publisher: Elsevier Ltd.
Published: 2018-03-02T16:00:00+00:00

Further Reading

1. Bohdansky J. A universal relation for the sputtering yield of monatomic solids at normal ion incidence. Nucl Instrum Methods. 1984;B2:587.

Chapter 8

Thin Film Deposition for Front End of Line

The Effect of the Semiconductor Scaling, Strain Engineering and Pattern Effects

Michael Belyansky, IBM Research, Albany, NY, United States

Abstract

Performance challenges of Moore’s Law and continuation of scaling in the microelectronics industry have a profound effect on chemical vapor deposition (CVD) techniques and processes. This chapter covers two different topics which became increasingly important in the industry due to the scaling-related issues: the effect of intrinsic film stress on a semiconductor device, and the interaction of CVD deposition with pattern density. The chapter surveys new developments in highly strained thin dielectric films, deposition techniques, and material modification to meet the needs of microelectronics scaling and to ensure adequate control of CVD film thickness and properties. While the chapter uses mostly amorphous dielectric CVD films as an example, these two topics are applicable to many other CVD and atomic layer deposition (ALD) processes.

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